Device Versions: V0, V1, V2.

  • Designed multiple modular 2 layer mixed signal PCBs with average 0603 passive components and standard SOP IC packages.
  • Designed a 4 layer, single (31 mil thick) mixed signal PCB with average 0201 passive components, lead-less IC packages (QFN and BGA) and a detachable debugging and programming interface (Panelized Design).

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